收藏本站
DATASHEET
5mm Infrared LED
SIR333-A
Notes
1.
Lead Forming
?
?
?
?
?
During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.
Lead forming should be done before soldering.
Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it
may break the LEDs.
Cut the LED lead frames at room temperature. Cutting the lead frames at high temperatures may cause failure of the LEDs.
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs
are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs.
2.
Storage
?
?
The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight and the storage life limits
are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a
nitrogen atmosphere and moisture absorbent material.
Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can
occur.
3.
Soldering
?
?
Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb,
and soldering beyond the base of the tie bar is recommended.
Recommended soldering conditions:
Hand Soldering
DIP Soldering
Temp. at tip of iron
Soldering time
Distance
300 ℃ Max. (30W Max.)
3 sec Max.
3mm Min.(From solder
joint to epoxy bulb)
Preheat temp.
Bath temp. & time
Distance
100 ℃ Max. (60 sec Max.)
260 Max., 5 sec Max
3mm Min. (From solder
joint to epoxy bulb)
?
?
?
?
?
Recommended soldering profile
laminar wave
Fluxing
Prehead
Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering.
Dip and hand soldering should not be done more than one time
After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to
room temperature.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
7
www.everlight.com
:3
Revision Copyright ?
LifecyclePhase:
No: Release
2010, Everlight All Rights Reserved. Release Date : Mar.29.2013. Issue DIR-0000952 Date:2013-05-30 14:24:46.0
Expired Period: Forever
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*
相关PDF资料
SIR383C LED IR 5MM BLUE WATER CLEAR AXL
SIR383 LED IR 5MM BLUE WATER CLEAR AXL
SIR404DP-T1-GE3 MOSFET N-CH D-S 20V 8-SOIC
SIR406DP-T1-GE3 MOSFET N-CH D-S 25V PPAK 8SOIC
SIR414DP-T1-GE3 MOSFET N-CH D-S 40V 8-SOIC
SIR418DP-T1-GE3 MOSFET N-CH D-S 40V PPAK 8SOIC
SIR436DP-T1-GE3 MOSFET N-CH D-S 25V PPAK 8SOIC
SIR440DP-T1-GE3 MOSFET N-CH 20V 60A PPAK 8SOIC
相关代理商/技术参数
SIR333-A_05 制造商:EVERLIGHT 制造商全称:Everlight Electronics Co., Ltd 功能描述:5mm Infrared LED, T-1 3/4
SIR333C 制造商:Everlight Electronics Co 功能描述:LED INFRARED - Bulk
SIR333C/H0/L9 制造商:EVERLIGHT 制造商全称:Everlight Electronics Co., Ltd 功能描述:5mm Infrared LED, T-1 3/4
SIR333C-H0 制造商:EVERLIGHT 制造商全称:Everlight Electronics Co., Ltd 功能描述:5mm Infrared LED, T-1 3/4
SIR-341ST3F 功能描述:红外发射源 IR EMITTER FOR REMOTE CONTROLLER RoHS:否 制造商:Fairchild Semiconductor 波长:880 nm 射束角:+/- 25 辐射强度: 最大工作温度:+ 100 C 最小工作温度:- 40 C 封装 / 箱体:Side Looker 封装:Bulk
SIR-341ST3F_10 制造商:ROHM 制造商全称:Rohm 功能描述:Infrared light emitting diode, top view type
SIR-341ST3FF 功能描述:EMITTER IR 940NM RADIAL RoHS:是 类别:光电元件 >> 红外发射极 系列:- 标准包装:1,200 系列:- 电流 - DC 正向(If):100mA 辐射强度(le)最小值@正向电流:27mW/sr @ 100mA 波长:940nm 正向电压:1.6V 视角:40° 方向:顶视图 安装类型:通孔 封装/外壳:径向 包装:带卷 (TR)
SIR-341ST3FM 制造商:ROHM Semiconductor 功能描述: